| Vistec SB250 Series |
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| Overview |
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The Vistec SB250 electron beam lithography system has been designed as a universal and cost-effective tool for both direct write and mask making applications to allow the customers to react flexibly on market demands. With its 210 x 210mm˛ stage travel range it is the ideal tool for exposing masks up to 7 inch and wafers up to 200 mm diameter.
The modular system architecture allows your SB250 to be easily upgraded to a higher tool performance.
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| Key Features |
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To meet the specific requirements of our customers the following features are optionally available:
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Various substrate sizes and types supported by fully automatic substrate handling |
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Multipass writing |
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Layout data preparation station covering up to 32+2 CPUs for:
- fracturing
- plus additional Proximity Effect Correction (PROXECCO) and fogging correction options |
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Graphical User Interface (GUI) compliant to SEMI E95 |
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