The enhancements to the VB300 centre on the new composite plinth assembly that provides a lower centre of gravity, a stiffer platform and highly damped construction which supports the new 320mm stage and offers a significant gain in noise induced error budget. Substrate loading is achieved via either a 10-holder airlock for mixed substrate types, FOUP or cassette based front end with industry standard interfaces for wafers up to 300mm.
A unique feature of the VB300 is its vertical Z-axis control allowing application flexibility where lithography is required on non-standard thickness substrates giving access to a whole new range of MEMS applications.
The Vistec VB300 system builds on the performance of the VB6 series, adding a more flexible user interface and many new tools for job preparation, review and diagnostics. With its enhanced reliability and serviceability the VB300 makes it ideally suited for users in both production and leading edge nano-lithography for both direct write and mask making.
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