Vistec SB351

Overview

The high-precision stage features a travel range of 310mm x 310mm, which allows complete exposure of 300mm wafers for direct write applications. The Vistec SB351 is fully compatible with SEMI standard mask sizes up to 9 inches and wafer sizes up to 300mm. The proven combination of the “write-on-the-fly” writing mode and the Flexible Stage Speed (FSS) principle increases throughput – an essential parameter for commercial applications as mask making and Electron Beam Direct Write.

Key Features

90nm production node and 65nmnode R&D capability for both mask writing as well as direct write applications

50keV electron optics with 1nm writing/address grid

Sophisticated Proximity Effect Correction (PROXECCO)

Mini-environment with fully automatic substrate handling and amine filters to support CAR

Intelligent and fast pattern data handling by compact hierarchical data structures and multi threading or distributed processing

Detailed Description

The high-precision stage features a travel range of 310mm x 310mm, which allows complete exposure of 300mm wafers for direct write applications. The Vistec SB351 is fully compatible with SEMI standard mask sizes up to 9 inches and wafer sizes up to 300mm. The proven combination of the “write-on-the-fly” writing mode and the Flexible Stage Speed (FSS) principle increases throughput – an essential parameter for commercial applications as mask making and Electron Beam Direct Write.

http://lithogroup.vistec-semi.com