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| Overview |
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The Vistec SB351 system is prepared for the 90nm node and features the 65nm R&D capability node. Thanks to their modular system architecture the SB351 variable shaped-beam system are used for both mask making (incl. nanoimprint) and direct write. Fully automatic substrate handling and network-supported operation software allow production, prototyping and R&D work. Further highlights of the Vistec SB351 are the full 300mm wafer exposure capability and the fast data preparation software including Proximity Effect Correction.
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| Key Features |
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90nm production node and 65nmnode R&D capability for both mask writing as well as direct write applications |
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50keV electron optics with 1nm writing/address grid |
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Sophisticated Proximity Effect Correction (PROXECCO) |
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Mini-environment with fully automatic substrate handling and amine filters to support CAR |
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Intelligent and fast pattern data handling by compact hierarchical data structures and multi threading or distributed processing |
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| Detailed Description |
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| The high-precision stage features a travel range of 310mm x 310mm, which allows complete exposure of 300mm wafers for direct write applications. The Vistec SB351 is fully compatible with SEMI standard mask sizes up to 9 inches and wafer sizes up to 300mm. The proven combination of the “write-on-the-fly” writing mode and the Flexible Stage Speed (FSS) principle increases throughput – an essential parameter for commercial applications as mask making and Electron Beam Direct Write. |
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| http://lithogroup.vistec-semi.com |
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