Vistec VB300

Overview

The enhancements to the VB300 centre on the new composite plinth assembly that provides a lower centre of gravity, a stiffer platform and highly damped construction which supports the new 320mm stage and offers a significant gain in noise induced error budget. Substrate loading is achieved via either a 10-holder airlock for mixed substrate types, FOUP or cassette based front end with industry standard interfaces for wafers up to 300mm. A unique feature of the VB300 is its vertical Z-axis control allowing application flexibility where lithography is required on non-standard thickness substrates giving access to a whole new range of MEMS applications. The Vistec VB300 system builds on the performance of the VB6 series, adding a more flexible user interface and many new tools for job preparation, review and diagnostics. With its enhanced reliability and serviceability the VB300 makes it ideally suited for users in both production and leading edge nano-lithography for both direct write and mask making.

Key Features

High current density Thermal Field Emission gun for operation at 50keV to 100keV

Rapid exposure with 50Mhz pattern generator and 20bit resolution

Ability to load piece part substrates to full 300mm wafers. Mask plates to 7inch

Routine production of line width structures to less than 10nm level

Continuously variable field size operation from 160microns to 1.2mm

Includes automatic 10-holder airlock as standard

Includes flexible system software and new user friendly GUI

Detailed Description

The enhancements to the VB300 centre on the new composite plinth assembly that provides a lower centre of gravity, a stiffer platform and highly damped construction which supports the new 320mm stage and offers a significant gain in noise induced error budget. Substrate loading is achieved via either a 10-holder airlock for mixed substrate types, FOUP or cassette based front end with industry standard interfaces for wafers up to 300mm. A unique feature of the VB300 is its vertical Z-axis control allowing application flexibility where lithography is required on non-standard thickness substrates giving access to a whole new range of MEMS applications. The Vistec VB300 system builds on the performance of the VB6 series, adding a more flexible user interface and many new tools for job preparation, review and diagnostics. With its enhanced reliability and serviceability the VB300 makes it ideally suited for users in both production and leading edge nano-lithography for both direct write and mask making.

http://lithogroup.vistec-semi.com